The new models of the MacBook Air and MacBook Pro have continued to stir a great buzz among tech sites and online discussions as reports claimed that such laptops will come with Intel’s fifth Generation Core processor.

Moreover, users who look forward to boost the performance of their MacBook can now achieve their goals by simply having their SSD upgraded.

The new MacBook Air will reportedly be powered by Intel’s latest Broadwell-Y Core M processors with which users can expect a power-efficient 4.5W performance.

Aside from saving up on power consumption, the new chip is also expected to bring about an additional 90 minutes of battery life, which is a significant upgrade from the current Haswell chip that Apple is using. 

In a report by IT Pro, it was also stated that Apple may have preferred to use the chip on the laptop as it gives a ‘fanless’ design. This will provide the MacBook Air with a newer look, aside from the expected 12-inch size.

Similarly, the latest MacBook Pro is also speculated to be shipped with Intel’s new chip owing to the fact that Apple typically provides the same treatments to its MacBook Pro and MacBook Air laptops, including chip upgrades.

Intel's senior Fellow Mark Bohr explained why it took a longer time for the chips to be delivered.

“I think we may have underestimated the learning rate - when you have a technology that adds many more masks, as 14[nanometres - nm] did ... it takes longer to execute experiments in the fab and get information turned, as we describe it,” Bohr stated.

Such factors are often crucial for Apple and other PC makers that depend on chip manufacturers for the development and release of their devices.

Meanwhile, in another patent sighting, the tech giant is reportedly developing a new MacBook Hinge as the new patent application goes by the title ‘Hinged Portable Electronic Device with Display Circuitry Located in Base.’

This suggests a housing and lid which can rotate while connected to the base in order to get rid of standard practices, such as the use of coaxial cables and large hinge structures that put pressure on the laptop’s cables.

However, it remains unconfirmed whether such patent will be integrated into the upcoming MacBook Air and MacBook Pro.